Industry Standards with spacing distances. For regulatory rules and requirements, see these standards: IPC-2221A, Generic Standard on Printed Board Design, addresses spacing in sections 6.3 and 10.1.4, along with table 6-1. UL 61010A-1, Electrical Equipment For Laboratory Use; Part 1: General Requirements UL 61010B-1, Electrical Equipment For Measurement, Control, and Laboratory Use; Part 1: General Requirements. See Annex C - Measurement of Clearances and Creepage Disstances, Annex D - Parts between which insulation requirements are specified (see 6.4 and 6.5.2) UL 60950, Safety of Information Technology Equipment NFPA 70 - National Electrical Code®. An old, obsolete version for reference is available online . See pages 774-775, table 490-24 UL 840, Insulation Coordination Including Clearances and Creepage Distances for Electrical Equipment. These requirements cover an alternate approach to specifying through air and over surface spacings for electrical equipment through the use of the principles of insulation coordination.
Corona: A phenomenon that has the capability for degrading insulators, and causing systems to fail. In this discussion, formulas are provided to calculate the voltage at which corona occurs, and a mention is made of a useful application for corona.
Circuit makes simple high-voltage inverter: A simple high-voltage MOSFET inverter solves the problem of driving a high-side MOSFET, using a low-voltage transistor. You can drive the circuit with a single CMOS gate. This circuit is probably the simplest high-voltage inverter you can design.
A collection of related articles. This is a group of excellent papers relating to the design of high voltage power supplies with pulsed loads, such as radar. An ingenious power conversion topology is proposed.
High Voltage Relays: When defining relays for high voltage applications, a good starting place is MIL-R-83725. This and other mil standards are available fromhttp://www.mil-standards.com. For specifications on specific relays (also known as slash sheets), seehttp://www.dscc.dla.mil/Programs/MilSpec
"Packaging Factors for Next Generation High Voltage, High Temperature Power Electronics Modules," J.S. Bowers, D.C. Hopkins and W.J. Sarjeant, Proc. of the High Temperature Electronics Conference, Albuquerque, NM June, 2000. For more details and for other informaion on packaging power electronics, see seminars and also Dr. Douglas C. Hopkins.The seminar provides the power electronics designer with an in-depth description of leading and next-generation power packaging techniques used in supplies and drives
HVDC Power Distribution.There is about 80,000 MW of HVDC transmission capacity in operation or under construction. This encompanses roughly 100 projects worldwide. Also described is HVDC Light®, a technology that is designed for underground and submarine power transmission.
HVDC Transmission Technology Overview along with operating principles, station design, cables and a description of Vancouver Island power supply.
